Past Research |
Solar House
In 2002 SRI was instrumental in the design and construction of the Auburn University solar house. This house was part of a decathalon funded by the Department of Energy in which 15 universities competed to make a completly energy self sustaining home. Some technologies from the solar house, which is still located at Auburn University, have been integrated into the Katrina Cottage concept home. For more information about the AU solar home go here.
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ThermoPhotoVoltaics & Selective Emitters
In 1995 SPI did research into using rare earth oxides as emmitters for a selective emitter thermophotovoltaic system. The purpose of this project was to take a broad spectrum thermal energy source, in our case a combustable flame, and convert it to a narrow band. To do this photon emitters were manufactured from rare earth oxide so that their radiative energy would match certian high efficienty photovoltaic cells. |
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Enery Storage Research
Begining in the mid 1980's SRI partnered with Sohio industries to develop the chemical double layer capacitor (CDL). This research later migrated into work in carbon nickel capacitors, and eventually into ruthenium oxide capacitors. Some notable copywrite patients have been a result of some of the capacitor research at SRI. One example of this would be the Boost Capacitor ™ which integrated research developments engineered at SRI and later licensed by our then industrial partner Maxwell Laboratories. |
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High Temperature Power Electronics Packaging
With a lunar ambient of +120 degrees C on the sunlit surface, power electronics modules will inherently operate hot. Without the aid of convection on the lunar surface, radiators to reject waste heat are a major component in terms of size and weight in a power electronics system. Given the T 4 relationship for heat transfer by radiation, increasing the radiator temperature and the temperature of the corresponding power electronics dramatically reduces the size of the radiator. |
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Cabin Atmosphere Revitalization
Microfibrous Materials provide for the mechanical and electrical entrapment of a particle or fibrous solid within sinter- locked networks of a secondary fibrous matrix. The volume loading of each phase is adjustable over a wide range compared to current SOA materials and practices. Total chemical and biological protection has been demonstrated for full buildings. CO, CO2, NH3, H2S, and other chemicals have also been removed with full regenerability. |
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Intelligent, Modular Power Systems for Extreme Environments
To meet the Space Exploration goals, NASA needs modular power systems for operation in the extreme environments of the Moon and Mars. The goal of this program is to develop distributed, intelligent power electronic modules (PEMs) for dc- dc converters, motors, and actuators to improve control robustness, transform PEMs into electrical- system health monitors that can communicate with a master system processor, and enable a modular architecture to improve system reliability and reconfigurability. |
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3D Embedded Chip Electronic Module
Embedded chip/component technologies have been developed by GE (HDI) and Soldering Technology International (IC/ DT). Bare die and passive components are embedded inside of printed circuit board substrates, which can be tightly stacked to form a dense module. Such 3D assemblies offer extreme high density packaging with potential advantages in reliability, thermal performance, and vibration resistance. CTE- matched assembly materials will be evaluated also. |
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SiC Static Induction Transistors (SITs)
In 1997 Westinghouse entered the HDTV market using SiC Static Induction Transistors supplied by Northrup Grumman. These SITs contain technologies developed in partnership with Auburn University. Specifically Auburn contributed the Ni2Si n-type ohmic contacts and the Ni n-type Schottky barriers. The system level impacts of SiC in this application were to provide costs less than 1/2 that of Si devices at four times the power level and four times the energy density. In fact, the costs approximate that of conventional tube transmitters but use less space and energy are more reliable and safer and have reduced maintinence due to inherent modularity.
Advanced Vehicle Electronics
In 1999 Chrysler introduced an electric transaxle control unit based on their partnership with Auburn University that uses a MultiChip Module (MCM) and careful layout of power components that condensed two circuit boards into a single unit. This unit was more reliable and had extensive thermal and mechanical modifications that allowed placement of components to prolong life, reduce stress, and saved $8/module. At over 100,000 units produced the cost savings were significant. This application would likely not have evolved had it not been for the technology transfer that occurred between Chrysler and Auburn University.
Die Attach Studies
Auburn University teamed up with Caterpillar and United Technologies to develop a program to determine the stresses encountered by a silicon chip as it went through the attachment and packaging process. In this Auburn developed technology, piezoresistive sensor rosettes were formed on the surface of a test die which was then subjected to processing. The design of the rosette was such that it was possible to obtain all six components of the stresses that resulted from subsequent processing. The measured results obtained from the sensor rosettes was then directly compared to the calculated stress values. Excellent agreement was generally obtained, thus allowing selection of the best processing methods. Also, detailed modeling of chip-on-board solder attachment variations were compared to experimental measurements to provide a robust, cost effective process.
High Temperature Components
High temperatures in passive electronic components have traditionally made these components susceptible to failure. In an effort to improve survivability of components in extreme conditions, Auburn University partnered with United Technologies to determine suitable power and signal passive components for these applications. Also the means for reliably attaching such components with silver-filled silicones, epoxies, and polyimides and various substrate combinations were also evaluated.
Telecommunications
Auburn University designed and produced a voice mail power supply for the IBUS a subsidiary of Maxwell Technologies. This unit was built using commercially available off-the-shelf components and fully met all specifications. The Auburn unit exceeded the efficiency of the existing unit by more than 20%, it's efficiency did not change at either full or half power in contrast to the existing unit. The no-load power consumption was 1/3 of the existing unit, down to only 12 watts. In addition the unit contained various new intelligent features including: over temperature shut down, overvoltage/current protection, output voltage out of calibration and automatic restart after a fault.
Additional Areas of Past Research: |
Diamond Thin Film
Atomic Oxygen
High Voltage Electric Breakdown
Thermal Diffusivity
Advanced Packaging Technologies
Fuel Cells
Microelectronics
Casting Technology
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